HP-NTU Corp Lab TechTalk: 3D Printed Electronics with Multi Jet Fusion (23 Feb, Tues, 10am-11am, SGT)

HP-NTU Digital Manufacturing Corp Lab is pleased to have Mr. Kris Erickson, Research Manager and Senior Research Scientist in the 3D Labs at HP, to share with us for our next Tech Talk. He will be sharing about the 3D Printed Electronics approach based upon HP's commercial 3D Print technology, Multi Jet Fusion (MJF). 

Date: 23 February 2021, Tuesday, 10:00am - 11:00am (SGT)

Venue: Virtual Talk - Zoom link will be shared with registered participants

Register here

About the speaker:
Kris Erickson is a Research Manager and Senior Research Scientist in the 3D Lab at HP Labs, leading R&D projects in multiple topical areas of 3D printing. He obtained his PhD in Chemistry at the University of California – Berkeley researching nanomaterials and was a post-doctoral appointee at Sandia National Labs prior to joining HP. At HP, his research has spanned from 3D polymer printing to 3D metal printing and 3D printed electronics, with an emphasis on materials and applications development.

Synopsis:
HP Labs has been exploring and developing a 3D Printed Electronics approach based upon HP’s commercial 3D Print technology, Multi Jet Fusion (MJF). During this talk, I will elaborate upon the 3D print method used for creating high conductivity traces, vias, and contact pads anywhere within a 3D printed part. This approach takes advantage of many of the attributes of MJF, like utilizing multiple fluids during printing and printing multiple parts at the same time, creating parts at high print speeds with final part strengths similar to MJF.

I will also cover the 3D PE design software which we have begun to develop which combines EE and ME CAD such that complex devices can be designed. I will then go over the fabrication of active electronic devices, printing of passives like resistors and capacitors, RF antenna developments, as well as other complimentary efforts like post-processing parts through electroplating.