Seminar on An integrated design of process and materials for fabricating high-performance polymers of dual cure resin using digital light processing

Prof. Hae-Jin Choi

Chung-Ang University, South Korea

This seminar will be chaired by A/P Moon Seung Ki.

Despite having high accuracy and excellent processability, low mechanical properties of photopolymer resin have a significant limitation for their use in engineering applications.  Therefore, it is necessary for integrated design of materials and processes for fabricating polymers with excellent mechanical properties. In this study, epoxy-based photo-thermal dual cure resin was developed and novel design of DLP 3D printing system was introduced to fabricate the high-performance polymers. This dual cure resin consists of photo-curable resin called P resin and thermal-curable resin called T resin with appropriate weight ratios. Also, DLP printing system that includes a special module such as layer coating system, heating system, wiping system, dispensing system for high-strength polymers of dual cure resin was developed. After fabricating both a green part and undergoing UV post curing, it was subsequently thermally post cured to achieve superior mechanical properties under the specific thermal curing condition. Each UV/Thermal post curing condition were optimized using various result of analysis such as viscosity analysis, FT-IR analysis, and tensile test. The resulting dual cure resin shows the outstanding mechanical properties including tensile strength over 100 MPa. It offers novel approaches for additive manufacturing of complex geometry part with excellent mechanical properties and various application of engineering fields.