Thermal Management System

Rapid, Precise, On-Demand Temperature-Stabilisation and Cooling Enhancement Devices Using Two-Phase Heat Transfer and Dielectrophoretic Effect

Synopsis

This invention introduces a groundbreaking thermal management system that offers precise, on-demand temperature stabilisation and enhanced cooling, revolutionising heat management in electronic devices and industrial systems.


Opportunity  

As electronic devices and industrial systems continue to shrink in size, managing heat becomes increasingly challenging. This technology provides a reliable solution with enhanced cooling capacity and rapid, precise temperature control, ensuring that systems will remain cool and efficient even in high-stakes applications such as computing and electronic manufacturing. The dual-function system enhances cooling performance while providing rapid and precise temperature stabilisation. Ideal for sectors demanding advanced thermal solutions, including computing (data centres, high-performance computing) and electronics manufacturing, this technology meets a critical market need. 

 

Technology  

This system leverages a unique integration of two-phase heat transfer and the dielectrophoretic effect to deliver exceptional cooling and temperature stabilisation. The dual-action mechanism allows for rapid adjustment of cooling intensity, ensuring optimal thermal conditions are quickly met and maintained. Adjustable parameters such as voltage, modulation frequency and electrode design offer tailored thermal management solutions for various applications. Real-time temperature feedback provides immediate responses to thermal changes, ensuring system safety and efficiency. 

 

Figure 1: Overview of the groundbreaking thermal management system.

Figure 1: Overview of the groundbreaking thermal management system.

 

Applications & Advantages  

Main application areas include electronics cooling, microprocessor manufacturing and large-scale industrial processes. 

Advantages 

  • Rapid, precise temperature control.
  • High-capacity heat dissipation.
  • Prevents overheating and thermal system failure.
  • Scalable from microelectronics to large industrial setups.
  • Enhanced longevity and performance of devices.
  • Modular design for easy integration and adaptation. 

Inventor

Prof Tuan TRAN